According to Gizmochina , although designed for the mid-range smartphone segment, the Dimensity 8300 offers outstanding power, including significant improvements in performance and AI (artificial intelligence) capabilities. Manufactured on TSMC's second-generation 4nm process, MediaTek's new chip offers significant performance improvements over its predecessor.

TS2-SPACE SCREENSHOT

The chip is manufactured on a 4nm process and has a 3-tier CPU architecture with 1 Cortex-A715 core clocked at 3.35 GHz, 3 Cortex-A715 cores clocked at 3 GHz, and 4 Cortex-A510 cores clocked at 2.2 GHz. This configuration promises a 20% performance increase and 30% better efficiency than the Dimensity 8200.

The Dimensity 8300's graphics capabilities have also received a major upgrade, with the Mali-G615 MC3 GPU offering a 60% performance boost and a 55% increase in efficiency. That translates to smooth and responsive gaming on devices powered by the chip.

The Dimensity 8300 also brings some improvements to the camera department, such as 4K/60fps HDR video support, more power-efficient video recording, and AI-Color functionality for improved image quality. Another interesting feature of the chip is the APU 780 AI silicon, which supports large language models (LLMs) with up to 10 billion parameters. This enables features like real-time language translation, text summarization, and even creative writing.

Other notable features of the Dimensity 8300 include AV1 decoding, Bluetooth 5.4, Wi-Fi 6E, and support for refresh rates up to 120Hz at WQHD+ resolution (or 180Hz at FHD+). The first smartphone to feature the Dimensity 8300 will be the Redmi K70e, which Xiaomi is expected to launch later this month.